Technologies

Overview

Through adhesive bonding technique, we offer products that would be difficult to realise as integral molding made of CIP material.

Characteristics

Function

There is no strength degradation even after high temperature treatment, we have experiences with up to 2800°C (heater).

Through the glued connection, the contact resistance is lowered, thus local heating is inhibited and the consumed energy can be reduced by up to 30 % or even more in some cases.

Link to related product

• Production of semi-conductor Single crystals (CZ, solar)

• Graphite for ion implanters

• Heaters for industrial furnaces, furnace parts

• Hot press