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Adhesive Bonding

Overview

Through adhesive bonding technique, we offer products that would be difficult to realise as integral molding made of CIP material.

Characteristics

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Function

There is no strength degradation even after high temperature treatment, we have experiences with up to 2800°C (heater).

Through the glued connection, the contact resistance is lowered, thus local heating is inhibited and the consumed energy can be reduced by up to 30 % or even more in some cases.

Link to related product

Reduction of contact resistance due to adhesive bonding

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